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  • 2017-12-18 / New EFEM 300mm

    Coming soon! RECIF is about to launch its brand new EFEM 300mm in 2018!

    EFEM 300 web1

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  • 2017-05-31 / Bpifrance award distinction

    RECIF received an award distinction from Bpifrance

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  • 2016-10-24 / Demonstration of 450mm wafer sorter completed

    RECIF completes the demonstration of its 450mm wafer sorter

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  • 2016-11-30 / G5+, New 300mm wafer sorter platform

    RECIF Technologies announces the release of the G5+, its new 300mm wafer sorter platform

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  • 2016-04-15 / Award distinction from TSMC

    RECIF receives an award distinction from TSMC

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  • 2015-10-02 / RECIF & AGILEO / Successful Integration

    Successful integration of Agileo Automation's software framework : A²ECF with RECIF Technologies EFEM

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  • 2015-10-07 / Speaker at the STC - SEMICON Europa

    RECIF Technologies will be speaker (Alain Jarre-CEO) at the STC Semiconductor Technology Conference, at Semicon Europa 2015.

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  • 2015-09-21 / New 300mm prototype @ imec for 7nm

    RECIF delivers its new 300mm prototype to imec for 7nm

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  • 2015-07-09 / RECIF & PEER Group / successful integration

    Successful integration of PEER Group PTO™ with RECIF Technologies EFEM

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  • 2015-04-14 / Successful RECIF & AIS integration

    Successful integration of AIS Automation CTC with RECIF Technologies EFEM

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  • 2015-04-03 / NGC450 ended on a success

    After 3 years of collaborative work, the NGC450 project ended on a technical success

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  • 2014-03-01 / RECIF installs the first 450mm EFEM at imec

    RECIF delivered its first 450mm prototype of wafer sorter /EFEM in March 2014

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  • 2014-01-23 / Panellist at the More than Metro conference

    RECIF Technologies participated (Alain JARRE, CEO) as panellist to the "More than Metro : Enabling 450mm Silicon Wafer Metrology" conference.

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  • 2013-10-09 / Speaker at the 450mm Session - Semicon Europa

    RECIF Technologies will be speaker (Alain Jarre-CEO) at Semicon Europa 2013, for the 450mm session.

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  • 2013-10-08 / Panelist at the 7th Executive Summit

    RECIF Technologies will be panellist (Alain Jarre) at the 7th Executive Summit.

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  • 2013-10-20 / Mr Jarre speaker at 450mm conference

  • 2013-06-18 / Technical Note - G5 pwp @ 26 nm

    RECIF's G5 platform reached outstanding cleanliness performances @ 26 nm.

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  • 2013-04-30 / Business Update

    RECIF receives multiple equipments order from a major foundry, to support its new line capable of manufacturing IC's down to 20nm. 

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  • 2013-04-29 / Enable 450mm News

    RECIF participates with Intel and other few major actors of European semiconductor industry, to co-ordinate European equipment and materials activities around the transition to 450mm diameter wafers.

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  • 2013-01-09 / Alain Jarre joins the SEMI European Advisory Board

     

    Alain Jarre; Chairman and CEO of RECIF Technologies S.A.S; has been appointed as member of the SEMI European Advisory Board in September 2012.

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  • 2011-12-15 / 450mm Update - NGC450 Project

     

    The NGC450 project, led by RECIF Technologies started in December 2011.

    The goal of this project is to enable in Europe the development of a wafer handling platform, dedicated to support the 450mm wafer size transition.

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  • 2011-04-04 / RECIF Technologies is part of OSEO Excellence network

     

    Logo OSEO EXCELLENCE 2011 small

    Recif Technologies invited to join OSEO excellence Network on March 16th 2011 kick-off meeting chaired by French president.

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  • 2011-01-15 / New products FLM300 & G5 wafer sorter selected for a new wafer Fab...

    FLM Front vignette

    RECIF Technologies received a multi-million order (€) as exclusive wafer sorter & buffer supplier, from new wafer Fab in Far East Asia.

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  • 2010-10-14 / NGC450 project labelled by the CATRENE organization

    Catrene Labelization NewsHP

     

    NGC450, project led by RECIF Technologies, was labelled under the 3rd call by the CATRENE organization.

     

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