RECIF Advanced Purge : Another Milestone for SMART Manufacturing
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RECIF together with Entegris & imec bring purge efficiency to the next level.
This collaboration aimed to yield new Advanced purge capabilities to protect wafers when the FOUP is open.
Thanks to its "Advanced Purge", RECIF Technologies is able to reduce N2 consumption by more than 50%, down to a N2 flow rate of 110 SLM while maintaining RH below 5% inside the opened FOUP.
To learn more about this breakthrough, download the News here
About Entegris (link)
About imec (link)
About ECSEL (link)
About Aeneas (link)
Special thanks :
Pin3S Project has received funding from the ECSEL Joint Undertaking (JU) under grant agreement No 826422. The JU receives support from the European Union’s Horizon 2020 research and innovation programme and Netherlands, Belgium, Germany, France, Romania, Israel.
