Products

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RECIF Technologies proposes a complete range of products dedicated to the handling and tracking of substrates.
Our products are applicable for wafer size of 6”, 8”, 12” or 18" diameters, for standard silicon wafers as well as for special substrates (dicing frame, 3D IC and TSV wafers, warped wafers...).
This covers the different functions and applications which are mandatory in IC manufacturing, either in manual handling lines, or in highly automated Giga Fabs.

Events

2017-07-11

SCWest2016 RGB intro

RECIF Technologies will attend the SEMICON West 2017 from July 11th to 13th 2017

News

2017-05-31

Bpifrance award distinction

RECIF received an award distinction from Bpifrance

BPI 2017 intro

Our locations

LocationHP
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