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RECIF Technologies proposes a complete range of products, mainly dedicated to the handling and tracking of silicon wafers.
Our products are applicable for wafer size of 6”, 8” or 12” diameters.
This covers the different functions and applications which are mandatory in IC manufacturing, either in 6” Fab, or in leading edge and highly automated 300mm Giga Fabs.

News

12/15/2011

450mm Update - NGC450 Project

The NGC450 project, led by RECIF Technologies started in December 2011.

 

The goal of this project is to enable in Europe the development of a wafer handling platform, dedicated to support the 450mm wafer size transition.

Our locations

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