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RECIF Technologies proposes a complete range of products dedicated to substrates handling.
Our products are applicable for wafer size of 6”, 8”, 12” or 18" diameters, for standard silicon wafers as well as for special substrates (dicing frame, 3D IC and TSV wafers, warped wafers...).
This covers the different functions and applications which are mandatory in IC manufacturing, either in manual handling lines, or in highly automated Giga Fabs.

News

from 2019-01-01 to 2019-12-31

BPI France Award Distinction 2019

Bpifrance EXCELLENCE BANNIERE SIGNATURE MEMBRE 2019 Webversion

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