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RECIF Technologies proposes a complete range of products dedicated to the handling and tracking of substrates.
Our products are applicable for wafer size of 6”, 8”, 12” or 18" diameters, for standard silicon wafers as well as for special substrates (dicing frame, 3D IC and TSV wafers, warped wafers...).
This covers the different functions and applications which are mandatory in IC manufacturing, either in manual handling lines, or in highly automated Giga Fabs.

News

2018-06-15

TSV-Handy review

TSV-Handy, a European project coordinated by RECIF

TSV Handy review June2018 intro2

Our locations

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