EFEM 300mm advanced substrates

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RECIF Technologies SMART EFEM is a product powered by the SMART platform concept to address the need for customized platforms, as well as the challenges raised by new applications such as 3DIC and advanced packaging.

 

It allows automated loading of 300mm wafers into metrology and process chucks.

 

Main features:

  • Compatible with main software controllers on the market
  • Compatible with standard silicon wafers, 3DIC (TSV / glass / stacks) & FO-WLP (mold compound / warped wafers)
  • Dual end effectors & dual aligners capability for fast wafer swap
  • Backside Advanced Contact Technology
  • Front side and backside wafer ID readers
  • ISO Class 1 mini-environment
  • Leading edge cleanliness performance (particle / ion-metal / AMC)
  • SEMI standards compliant
  • 2 or 3 Load Ports configuration
  • Compatible with all SEMI compliant FOUP / MAC / FOSB types

 

Introduction of SMART EFEM is to be announced soon.

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