SMART EFEM 300mm advanced substrates
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Plug & Play Solution for Wafer processing & Fast swap
SMART EFEM is our plug & play solution for emerging manufacturing technologies: Advanced-Packaging, 3D-IC, TSV... Equipped with our vacuum free 1 ACT end-effector, the SMART EFEM ensures a spotless & safe handling.
Enables the automated loading of 300mm wafers into metrology and process chucks with RECIF equipments' high performance.
Main features:
- Plug & play handling solution
- Software application compatible with main controllers' framework
- Heterogeneous handling: silicon, stacked, glass, mold compound, warped wafers
- Dual handling option for fast wafer swap: end-effector & aligner
- Backside Advanced Contact Technology
- Dual wafer ID readers
- ISO Class 1 mini-environment
- Leading edge cleanliness performance (particle / ion-metal / AMC)
- SEMI standards compliant
- 2, 3 or 4 Load Ports configuration
- Compatible with all SEMI compliant FOUP / MAC / FOSB types
1 Advanced Contact Technology
