SEMI Europe - Beyond 300mm workshop - 1st edition.


RECIF Technologies will be panellist at the SEMI Europe workshop « Beyond the 300mm: Packaging Challenges and Opportunities for 450mm wafers and Panel Scale solutions”.

This event will take place at NiMaPAD conference in Grenoble, April 24th 2012.

The workshop will treat of the wafer-size transition issues faced by the semiconductor industry for 450mm wafers.

Recif Technologies will take part to this workshop as semiconductor equipment manufacturer highly involved in the main European 450mm development projects such as EEMI450 and NGC450.

For more information about 450mm initiatives…

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