Technical Note - G5 pwp @ 26 nm



RECIF Technologies delivered in March 2013, multiple sets of G5 300 to a US based global leader in manufacturing solutions. After an “in depth particle characterization run”, the conclusion reached was that the G5 300 platform was entirely fulfilling, and even exceeding expectations in term of particle cleanliness, and otherwise.


The G5 platform has been characterized on the newly released KLA Tencor Surfscan SP3. The results demonstrated its capability to handle wafers with a ultra high level of cleanliness, down to a 26 nm particle size; the smallest ever performed. See results here after:



board pwp technical note web3  


Conclusion :

Thanks to its outstanding cleanliness results achieved at 26 nm and 40 nm, the G5 platform demonstrated its continuous improvement over the years, and proved being the tool of choice to support the wafer manufacturing at the most advanced nodes, toward the 1x nm and beyond.


Download the corresponding Technical Note.


View all news

Back to top