SMART EFEM 300mm advanced substrates


Plug & Play Solution for Wafer processing & Fast swap

SMART EFEM is our plug & play solution for emerging manufacturing technologies: Advanced-Packaging, 3D-IC, TSV... Equipped with our vacuum free 1 ACT end-effector, the SMART EFEM ensures a spotless & safe handling.


Enables the automated loading of 300mm wafers into metrology and process chucks with RECIF equipments' high performance.


Main features:

  • Plug & play handling solution
  • Software application compatible with main controllers' framework
  • Heterogeneous handling: silicon, stacked, glass, mold compound, warped wafers
  • Dual handling option for fast wafer swap: end-effector & aligner
  • Backside Advanced Contact Technology
  • Dual wafer ID readers
  • ISO Class 1 mini-environment
  • Leading edge cleanliness performance (particle / ion-metal / AMC)
  • SEMI standards compliant
  • 2, 3 or 4 Load Ports configuration
  • Compatible with all SEMI compliant FOUP / MAC / FOSB types

1 Advanced Contact Technology


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